Infineon DRAM

HyperRAM is a self-refreshing DRAM that uses the HyperBus interface, requiring only 13 signal pins compared to the 40+ pins needed by conventional DDR DRAM. It handles its own refresh cycles internally, eliminating the need for a complex DRAM controller on the host processor. This makes HyperRAM ideal for microcontroller-based embedded systems that need more memory than on-chip SRAM can provide but cannot accommodate the complexity of traditional DRAM.

Industrial and automotive products often have design lifetimes of 10 to 20 years or more. Commodity DRAM used in PCs and smartphones is frequently discontinued within 2-3 years as new generations arrive. Infineon commits to 15+ year product availability for its specialty DRAM portfolio, ensuring that industrial OEMs can maintain their designs without costly and time-consuming memory subsystem redesigns.

Known-good-die (KGD) DRAM are unpackaged, fully tested die that are used in System-in-Package (SiP) and multi-chip module (MCM) assembly. By integrating bare DRAM die directly alongside a processor or SoC in a single package, designers can achieve significant size and weight reductions while improving electrical performance through shorter signal paths. KGD options are particularly valuable for space-constrained wearable, medical, and automotive applications.

Yes. Level Solutions USA sources the full range of Infineon DRAM products, including extended-temperature variants rated for industrial (-40°C to +105°C) and automotive (-40°C to +125°C) environments. Our global procurement network can locate both standard and allocated parts with full traceability and authenticity verification.