NXP Modules
NXP Semiconductors offers advanced System-in-Package (SiP) memory modules that integrate processors and memory into compact, pre-validated solutions. These modules combine NXP application processors with DDR3 or DDR4 DRAM in a single package, eliminating the complexity of discrete memory subsystem design and significantly reducing board space, component count, and time-to-market.
Key Features
- Compact System-in-Package (SiP) packaging integrating processor and memory in one module
- Pre-validated configurations with tested memory timing and signal integrity
- Industrial temperature range (-40°C to +85°C) for reliable operation in harsh environments
- DDR3 and DDR4 memory integration for high-bandwidth embedded computing
- Automotive-qualified options (AEC-Q100) for vehicle infotainment, telematics, and ADAS
- Reduced PCB layer count and board area compared to discrete processor + memory designs
- Simplified BOM and supply chain with fewer discrete components to source
- Pre-certified EMC performance reducing regulatory compliance testing effort
Applications
Brands We Carry
We source memory products from Infineon, Microchip, NXP, Samsung, Micron, Toshiba, Cypress, and more.
Frequently Asked Questions
NXP SiP modules offer several advantages over discrete processor + memory designs. They eliminate the need for complex DDR routing on the PCB, which can reduce board layer count from 8-10 layers to 4-6 layers. The pre-validated memory interface removes the risk of signal integrity issues and saves weeks of design validation time. Additionally, the single-package approach reduces overall board area by up to 50% and simplifies the bill of materials and supply chain management.
NXP offers SiP modules based on their i.MX application processor families, including the i.MX 6, i.MX 7, and i.MX 8 series. These modules pair Arm Cortex-A cores with integrated DDR3 or DDR4 memory, providing a range of performance levels from cost-effective single-core solutions to high-performance multi-core platforms suitable for advanced HMI, edge computing, and automotive infotainment applications.
Yes. NXP offers automotive-qualified SiP modules that carry AEC-Q100 certification. These modules are tested to meet the extended temperature ranges, vibration, and reliability standards required by automotive OEMs. They are used in infotainment systems, digital instrument clusters, telematics units, and advanced driver assistance systems (ADAS) where compact size and pre-validated memory performance are essential.
Level Solutions USA can assist with identifying the right NXP module to replace your existing discrete processor and memory configuration. Our team provides cross-reference support, availability information, and competitive pricing to facilitate the migration. We also source both the modules and any remaining discrete components needed for your complete BOM, simplifying your procurement process through a single supplier relationship.
Related Products
NXP EEPROM
Automotive-grade and industrial EEPROM with I2C interface, AEC-Q100 qualified, and 100+ year data retention.
Infineon DRAM
Mobile and specialty DRAM including HyperRAM for embedded systems with low-pin-count interfaces.
Microchip SRAM
Asynchronous and serial SRAM from 4Kbit to 4Mbit with fast access times and battery-backed options.
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- (714) 265-7669
- ron@LevelSolutionsUSA.com